Power amplifier modules with bonding pads and related systems, devices, and methods

A power amplifier module comprising:

• a power amplifier die including an on-die passive device and a power amplifier, the power amplifier configured to amplify a radio frequency signal;
• a first bonding pad on a conductive trace and electrically connected to the on-die passive device by a first wire bond;
• and
• a second bonding pad on the conductive trace and electrically connected to an output of the power amplifier by a second wire bond, the second bonding pad being in a conductive path between the first bonding pad and a radio frequency output of the power amplifier module, and the second bonding pad including a nickel layer having a thickness that is less than 0.5 um, a palladium layer over the nickel layer, and a gold layer over the palladium layer and bonded to the second wire bond.

A power amplifier module comprising:

• a power amplifier die including an on-die passive device and a power amplifier, the power amplifier configured to amplify a radio frequency signal;
• a first bonding pad on a conductive trace, the first bonding pad electrically connected to the on-die passive device;
• and
• a second bonding pad on the conductive trace, the second bonding pad electrically connected to an output of the power amplifier and arranged such that current from the output of the power amplifier flowing through the second bonding pad flows away from the first ponding pad, and the second bonding pad including a nickel layer having a thickness that is less the skin depth of the nickel layer at 0.45 GHz, a palladium layer over the nickel layer, and a gold layer over the palladium layer.

A power amplifier module comprising:

• a power amplifier die including an on-die passive device and a power amplifier, the power amplifier configured to provide a radio frequency signal;
• a first bonding pad on a conductive trace, the first bonding pad electrically connected to the on-die passive device;
• and
• a second bonding pad on the conductive trace, the second bonding pad electrically connected to an output of the power amplifier and arranged such that current from the output of the power amplifier is directed away from the first ponding pad, the second bonding pad including a diffusion barrier layer having a thickness sufficiently small such that the radio frequency signal is allowed to penetrate to the conductive trace, a barrier layer over the diffusion barrier layer, and a bonding layer over the barrier layer.