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US 2017/0256850 A1Published application
High temperature transponders
AssigneeJamm Technologies, Inc.
InventorEzequiel MEJIA
Life of this patent
Estimating the term…
Abstract
The present invention provides, in alternative embodiments, high temperature transponders that can withstand high temperature shocks and can maintain their physical and electrical characteristics following high temperature exposure, and methods of making said transponders.
Claims21
1-9. (canceled)
A transponder, comprising:
- an antenna assembly, comprising:
- a core having a length ranging from 5 mm to 20 mm;
- an insulated wire disposed around the core in a coil, the insulated wire having a first end and a second end;
- and
- an integrated circuit chip, wherein the first end and the second end of the insulated wire are each connected to the integrated circuit chip;
- and
- a high temperature adhesive covering at least 50% of the insulated wire, wherein the adhesive is cured.
4 more elements
A transponder, comprising:
- an antenna assembly, including:
- a core;
- an insulated wire coiled around the core, the insulated wire having a first end and a second end;
- and
- an integrated circuit chip electrically coupled to the first end and the second end of the insulated wire;
- and
- a high temperature adhesive completely covering the insulated wire.
4 more elements
A transponder comprising:
- an antenna assembly including:
- a core having a width ranging from 0.5 mm to 5 mm;
- an insulated wire wound around the core, the wire having a first end and a second end;
- and
- an integrated circuit chip comprising two portions of a metal or metal alloy embedded into a surface of the integrated circuit chip, wherein the first and second ends of the wire are each connected to one of the two portions;
- and
- an adhesive covering at least 75% of the insulated antenna wire, wherein the adhesive withstands temperatures ranging from 180° C. to 270° C. without evaporating or expanding.
4 more elements
Dependencies are inferred from the claim text.