Conductive device substrate, method for manufacturing conductive device substrate, and display panel

Abstract

The disclosure provides a method for manufacturing a conductive device substrate. First, a carrier substrate is provided and an organic pillar is formed on the carrier substrate. Subsequently, a conductive layer is formed. The conductive layer covers the organic pillar to form a conductive pillar. The conductive pillar has a first surface and a second surface opposite to each other. Next, a substrate material layer is formed to cover the conductive pillar and the carrier substrate, and the substrate material layer includes an organic material. The substrate material layer exposes the first surface of the conductive pillar. Subsequently, a device layer is formed on the substrate material layer to electrically connect to the conductive pillar. In addition, a conductive device substrate and a display panel are also provided.

Dependencies are inferred from the claim text.