Package for ultraviolet emitting devices

A device comprising:

• a light emitting diode (LED) comprising a semiconductor structure comprising an active layer disposed between an n-type region and a p-type region, wherein the active layer emits UV radiation;
• a mount, wherein the LED is disposed on the mount;
• a support surrounding a conductive slug, the support comprising electrically conductive contact pads disposed on a bottom surface, and a thermally conductive pad disposed beneath the conductive slug, wherein the thermally conductive pad is not electrically connected to the LED;
• wherein the mount is disposed on the conductive slug;
• a circuit board, wherein support is disposed on the circuit board;
• and
• reflective sidewalls attached to the circuit board adjacent to the support.