Semiconductor device
AssigneeSharp Kabushiki Kaisha
InventorsYutaka TAKAMARU, Takao SAITOH, Yohsuke KANZAKI, Keisuke IDE, Seiji KENEKO
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AssigneeSharp Kabushiki Kaisha
InventorsYutaka TAKAMARU, Takao SAITOH, Yohsuke KANZAKI, Keisuke IDE, Seiji KENEKO
Estimating the term…
A semiconductor device includes a first conductive film, an insulating film, a second conductive film, and a semiconductor film. The insulating film is formed above the first conductive film such that the first conductive film includes an exposed portion that is exposed. The second conductive film is formed above the insulating film such that sides of the second conductive film are close to the exposed portion of the first conductive film. The semiconductor film includes a channel region for electrically connecting the second conductive film to the first conductive film via the channel region. The semiconductor film is formed above the second conductive film and across the exposed portion of the first conductive film from at least one side to another.
A semiconductor device comprising:
Dependencies are inferred from the claim text.