Semiconductor Device Structure and Method for Forming the Same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsPo-Chi Wu, Chai-wei Chang, Jung-Jui Li, Ya-Lan Chang, Yi-Cheng Chao
Life of this patent
Estimating the term…
Loading patent…
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsPo-Chi Wu, Chai-wei Chang, Jung-Jui Li, Ya-Lan Chang, Yi-Cheng Chao
Estimating the term…
A method for forming a semiconductor device structure is provided. The method includes forming a dielectric layer over a substrate. The dielectric layer has a trench passing through the dielectric layer. The method includes forming a gate stack in the trench. The method includes performing a hydrogen-containing plasma process over the gate stack. The method includes removing a top portion of the gate stack to form a first recess surrounded by the gate stack and the dielectric layer. The method includes forming a cap layer in the first recess to fill the first recess.
A semiconductor device structure comprising:
A device comprising:
A device comprising:
Dependencies are inferred from the claim text.