Semiconductor device, method of manufacturing the same, and signal transmitting/receiving method using the semiconductor device
AssigneeRenesas Electronics Corporation
InventorYasutaka NAKASHIBA
Life of this patent
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AssigneeRenesas Electronics Corporation
InventorYasutaka NAKASHIBA
Estimating the term…
A semiconductor device includes a semiconductor substrate including a semiconductor chip formation region, a chip internal circuit provided within the semiconductor chip formation region of the semiconductor substrate, a signal transmitting/receiving unit which is provided within the semiconductor chip formation region of the semiconductor substrate, transmits/receives a signal to/from an outside in a non-contact manner by one of electromagnetic induction and capacitive coupling, and transmits/receives a signal to/from the chip internal circuit through electrical connection to the chip internal circuit, and a power receiving inductor which has a diameter provided along an outer edge of the semiconductor chip formation region of the semiconductor substrate so as to surround the chip internal circuit and the signal transmitting/receiving unit, receives a power supply signal from the outside in the non-contact manner, and is electrically connected to the chip internal circuit.
1-13. (canceled)
A semiconductor device, comprising:
Dependencies are inferred from the claim text.