Fin-type field effect transistor structure and manufacturing method thereof
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChun Hsiung Tsai, Ziwei Fang, Tsan-Chun Wang, Kei-Wei Chen
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AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChun Hsiung Tsai, Ziwei Fang, Tsan-Chun Wang, Kei-Wei Chen
Estimating the term…
A fin-type field effect transistor comprising a substrate, at least one gate stack and epitaxy material portions is described. The substrate has fins and insulators located between the fins, and the fins include channel portions and flank portions beside the channel portions. The at least one gate stack is disposed over the insulators and over the channel portions of the fins. The epitaxy material portions are disposed over the flank portions of the fins and at two opposite sides of the at least one gate stack. The epitaxy material portions disposed on the flank portions of the fins are separate from one another.
A fin-type field effect transistor, comprising:
A fin-type field effect transistor, comprising:
13-20. (canceled)
A fin-type field effect transistor, comprising:
Dependencies are inferred from the claim text.