Methods of making semiconductor device packages and related semiconductor device packages

A method of fabricating a semiconductor device package, comprising:

• providing a fan out wafer comprising semiconductor-device-package locations at a base level, each semiconductor-device-package location comprising:
• at least two mutually spaced semiconductor dice and a dielectric material laterally surrounding each of the at least two mutually spaced semiconductor dice and extending between adjacent semiconductor-device-package locations;
• and
• electrically conductive traces extending over active surfaces of the at least two semiconductor dice and laterally beyond peripheries of the at least two semiconductor dice over the dielectric material to locations of electrically conductive vias extending from the electrically conductive traces through the dielectric material;
• stacking laterally offset semiconductor dice on at least some semiconductor-device-package locations of the fan out wafer to expose bond pads at a lateral periphery of each of the laterally offset semiconductor dice;
• electrically connecting the laterally offset semiconductor dice to one another and associated electrically conductive traces of the at least some semiconductor-device-package locations by forming wire bonds extending from a respective bond pad of an overlying semiconductor die of the laterally offset semiconductor dice to an adjacent bond pad of an underlying semiconductor die of the laterally offset semiconductor dice and by forming a wire bond extending from a respective bond pad of a lowest semiconductor die of the laterally offset semiconductor dice to an adjacent via of the electrically conductive vias or to an adjacent trace of the electrically conductive traces;
• and
• singulating the semiconductor-device-package locations having stacks of semiconductor dice thereon from the fan out wafer.