Semiconductor device on glass substrate and method of making the same

A lighting component including a glass substrate, a circuit trace formed on a surface of the glass substrate, and a plurality of micro-sized unpackaged semiconductor device die (“die”) connected to the glass substrate via the circuit trace, the plurality of die being distributed according to a predetermined pattern across the surface of the glass substrate, and the plurality of die being transferred to the glass substrate via a method comprising acts of:

• positioning the surface of the glass substrate to face a first surface of a die carrier carrying multiple die of the plurality of die thereon;
• actuating a reciprocating transfer member to thrust against a second surface of the die carrier at a position corresponding to a location of an initial die of the plurality of die on the first surface of the die carrier, the actuating of the transfer member causing a localized deflection of the die carrier in a direction of the surface of the glass substrate to position the initial die proximate to the circuit trace on the glass substrate;
• transferring the initial die directly to the circuit trace on the surface of the glass substrate;
• shifting at least one of the die carrier or the transfer member such that the transfer member aligns with a subsequent location of a subsequent die of the multiple die on the first surface of the die carrier;
• and
• repeating the acts of actuating, transferring, and shifting with respect to consecutive subsequent locations and corresponding consecutive subsequent die at a predetermined transfer rate to effectuate a transfer of the multiple die onto the glass substrate.