Systems of Bonded Substrates and Methods for Bonding Substrates with Bonding Layers

A system of bonded substrates, the system comprising:

• a first substrate comprising a bonding surface, wherein a geometry of the bonding surface of the first substrate comprises a plurality of microchannels;
• a second substrate comprising a complementary bonding surface;
• a bonding layer positioned between the first substrate and the second substrate, wherein the bonding layer fills the microchannels of the first substrate and contacts substantially the entire bonding surface of the first substrate, wherein the bonding layer comprises a metal;
• wherein:
• a geometry of the complementary bonding surface of the second substrate comprises a plurality of microchannels;
• and
• the bonding layer fills the microchannels of the complementary bonding surface of the second substrate and contacts substantially the entire complementary bonding surface of the second substrate;
• and
• the depth of each microchannel is from about 5 microns to about 10 microns.