Semiconductor device including antistatic die attach material
AssigneeInfineon Technologies AG
InventorsVolker Strutz, Rainer Markus Schaller, Franz-Peter Kalz
Life of this patent
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Abstract
A semiconductor device includes a substrate, a semiconductor die, and an antistatic die attach material between the substrate and the semiconductor die. The antistatic die attach material includes a mixture of a nonconductive adhesive material and carbon black or graphite. In one example, the antistatic die attach material has a resistivity between 101 Ω·cm and 1010 Ω·cm.
Claims13
1-8. (canceled)
A semiconductor device comprising:
- a substrate comprising a conductive material;
- an isolator;
- a semiconductor die;
- a first antistatic die attach material between the substrate and the isolator;
- and
- a second antistatic die attach material between the isolator and the semiconductor die,
- wherein the first and second antistatic die attach material comprises a mixture of a nonconductive adhesive material and carbon black or graphite flakes.
(canceled)
The method of claim 20, further comprising:
- mixing the nonconductive adhesive material with the carbon black or graphite flakes to provide the first antistatic material having a resistivity between 101 Ω·cm and 1010 Ω·cm.
The method of claim 20, further comprising:
- mixing the nonconductive adhesive material with between 1% and 2% by weight of the carbon black or graphite flakes to provide the first antistatic material.
A method for fabricating a semiconductor device, the method comprising:
- applying first antistatic material on a first substrate, the first antistatic material comprising a mixture of a nonconductive adhesive material and carbon black or graphite flakes;
- and
- placing a semiconductor die on the first antistatic material;
- curing the first antistatic material to attach the semiconductor die to the substrate;
- and
- wherein the first substrate comprises an isolating substrate, the method further comprising:
- applying second antistatic material on a second substrate comprising a conductive material, the second antistatic material comprising a mixture of a nonconductive adhesive material and carbon black or graphite flakes;
- placing the first substrate on the second antistatic material;
- and
- curing the second antistatic material to attach the first substrate to the second substrate.
Dependencies are inferred from the claim text.