Optical electronic device and method of fabrication

A combined wafer, comprising:

• a main wafer including a plurality of first sites and having a front face and which comprises a base wafer having optical elements on a top surface and located respectively within said first sites, the main wafer comprising a plurality of optical integrated circuit chips;
• a secondary wafer including a plurality of second sites and having recesses in a mounting face that are respectively formed within said second sites, wherein the first sites correspond to the second sites;
• wherein said main wafer and said secondary wafer are made of a same semiconductor material;
• and
• wherein said secondary wafer is mounted to the plurality of optical integrated circuit chips with the mounting face of the secondary wafer being mated to the front face of the main wafer in such a manner that the recesses are situated over the optical elements, so as to define a plurality of undiced optical electronic devices arranged in an array.

A method, comprising:

• forming a plurality of optical integrated circuit chips from a first semiconductor material wafer having optical elements located respectively at first sites;
• forming a second semiconductor material wafer including blind opening recesses located respectively at second sites, wherein the first sites correspond to the second sites;
• mounting the second semiconductor material wafer to the first semiconductor material wafer with the blind opening recesses facing the optical elements;
• reducing a thickness of the second semiconductor material wafer so as to open the blind opening recesses and form a grid with a plurality of through-passages aligned with the optical elements, the grid being mounted to the plurality of optical integrated circuits;
• and
• dicing through the first semiconductor material wafer and a remaining part of the second semiconductor material wafer to produce a plurality of electronic devices.

A method, comprising:

• providing a main wafer of optical integrated circuits comprising an optical element and an electrical connection network within a front layer, the front layer defining a front face;
• providing a secondary wafer having a plurality of blind opening recesses formed in a mounting face;
• mounting the mounting face of the secondary wafer to the front face of the main wafer such that each of the plurality of blind opening recesses is disposed above a corresponding optical element;
• reducing a thickness of the secondary wafer so as to open the blind opening recesses and form a grid with a plurality of through-passages aligned with the corresponding optical elements;
• and
• dicing through the main wafer and the grid to produce a plurality of individual electronic devices.