Semiconductor device having a boundary structure, a package on package structure, and a method of making

A semiconductor device, comprising:

• a substrate;
• a first conductive pad and a second conductive pad arranged over the substrate;
• a first boundary structure arranged around the first conductive pad;
• and
• a second boundary structure arranged around the second conductive pad, wherein the first boundary structure is laterally separated from the second boundary structure by a non-zero space.

A semiconductor device, comprising:

• a first solder material arranged over a first conductive pad over a substrate;
• a first boundary structure having a first sidewall contacting the first solder material and a second sidewall facing away from the first solder material;
• a second solder material arranged over a second conductive pad over the substrate;
• and
• a second boundary structure having a third sidewall contacting the second solder material and a fourth sidewall facing away from the second solder material, wherein the second sidewall is laterally separated from the fourth sidewall.