Semiconductor chip, semiconductor device and manufacturing process for manufacturing the same

A semiconductor device, comprising:

• a substrate main body;
• a plurality of first bump pads disposed adjacent to a surface of the substrate main body, each of the first bump pads has a first profile from a top view, the first profile has a first width along a first direction and a second width along a second direction perpendicular to the first direction, and the first width of the first profile is greater than the second width of the first profile;
• and
• a redistribution layer disposed adjacent to the surface of the substrate main body, wherein the redistribution layer includes a first portion disposed between two first bump pads.

A semiconductor device, comprising:

• a substrate main body having a surface, the substrate main body including a plurality of pads adjacent to the surface of the substrate main body;
• and
• a plurality of first metal bumps having a first profile from a top view and a plurality of second metal bumps having a second profile from a top view disposed on the pads;
• wherein the first profile of the first metal bumps is different from the second profile of the second metal bumps, and a cross-sectional area of each of the second metal bumps is substantially equal to a cross-sectional area of each of the first metal bumps.