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US 2017/0256481 A1Published application
Electronic package and semiconductor substrate
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsShih-Ching Chen, Shih-Liang Peng, Chieh-Lung Lai, Jia-Wei Pan, Chang-Lun Lu
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Abstract
A semiconductor substrate is provided, including a substrate body having a lateral surface, and a protruding structure extending outward from the lateral surface. The semiconductor substrate distributes stresses generated during a manufacturing process through the protruding structure, and is thus prevented from delamination or being cracked. An electronic package having the semiconductor substrate is also provided.
Claims17
A semiconductor substrate, comprising:
- a substrate body having a first surface, a second surface, and at least one lateral surface adjacent the first surface and the second surface;
- and
- at least one protruding structure extending outward from the lateral surface of the substrate body and occupying a pre-scribing path surrounding the substrate body.
Dependencies are inferred from the claim text.