Electronic components having three-dimensional capacitors in a metallization stack

A computing device, comprising:

• a circuit board;
• and
• an integrated circuit (IC) package coupled to the circuit board, wherein the IC package includes:
• a redistribution layer,
• a die, including a memory device or a processing device, coupled to the redistribution layer, and
• a capacitor disposed in the redistribution layer, wherein the capacitor includes:
• a first conductive plate having a recess, and
• a second conductive plate having a projection, wherein the projection extends into the recess without contacting the recess.

A method of manufacturing an electronic component having a three-dimensional capacitor in a metallization stack, comprising:

• forming a first conductive plate in the metallization stack, wherein the first conductive plate has a recess;
• providing a dielectric material on the first conductive plate;
• and
• forming a second conductive plate in the metallization stack on the dielectric material, wherein the second plate has a projection extending into the recess and spaced apart from the first conductive plate by the dielectric material.