Package structure
AssigneeIBIS Innotech Inc.
InventorsWen-Chun Liu, Wei-Jen Lai
Life of this patent
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Abstract
A package structure including a substrate, a first lead frame, a first metal layer, at least one chip, a base and a second metal layer is provided. The base includes a plurality of openings. The first lead frame is embedded in the substrate and includes a plurality of first pads, where the openings expose the first pads. The first metal layer covers the exposed first pads. The chip is disposed on the substrate and electrically connected to the first metal layer and the first pads. The base covers the substrate with its bonding surface. The second metal layer covers a base surface of the base.
Claims25
A package structure, comprising:
- a substrate, comprising a plurality of openings;
- a first lead frame, embedded in the substrate, and comprising a plurality of first pads, wherein the openings expose the first pads;
- a first metal layer, covering the exposed first pads;
- at least one chip, disposed on the substrate, and electrically connected to the first metal layer and the first pads;
- a base, covering the substrate with a bonding surface;
- and
- a second metal layer, covering a base surface of the base.
Dependencies are inferred from the claim text.