Systems and methods for spring-based device attachment
AssigneeToyota Motor Engineering & Manufacturing North America, Inc.
InventorsShailesh N. Joshi, Masao Noguchi
Life of this patent
Estimating the term…
Abstract
Apparatuses for coupling a semiconductor device to a cooling system, methods of coupling a semiconductor device to a cooling system, and systems incorporating the apparatuses are disclosed. An apparatus includes a first frame member coupled to the cooling system, a second frame member coupled via one or more fasteners to the first frame member, and a spring assembly disposed between the first frame member and the second frame member. The semiconductor device is disposed between the spring assembly and the second frame member.
Claims20
An apparatus for coupling a semiconductor device to a cooling system, the apparatus comprising:
- a first frame member coupled to the cooling system;
- a second frame member coupled to the first frame member by one or more fasteners;
- and
- a spring assembly disposed between the first frame member and the second frame member,
- wherein the semiconductor device is disposed between the spring assembly and the second frame member.
A method of coupling a semiconductor device to a cooling system, the method comprising:
- coupling a first frame member to the cooling system;
- placing a spring assembly on the first frame member;
- placing the semiconductor device on the spring assembly;
- placing a second frame member on the semiconductor device such that the semiconductor device and the spring assembly are disposed between the second frame member and the first frame member;
- and
- affixing the second frame member to the first frame member with one or more fasteners.
A semiconductor device assembly comprising:
- a cooling system;
- a first frame member coupled to the cooling system by a bottom layer;
- a second frame member coupled via one or more fasteners to the first frame member;
- a spring assembly;
- a semiconductor device;
- and
- a top layer coupled to the semiconductor device,
- wherein the spring assembly is disposed between the first frame member and the semiconductor device, the semiconductor device is disposed between the top layer and the spring assembly, the top layer is disposed between the semiconductor device and the second frame member, and the first frame member and second frame member provide a compressive force on the spring assembly, the semiconductor device, and the top layer to retain the spring assembly, the semiconductor device, and the top layer in a held configuration.
Dependencies are inferred from the claim text.