Module
AssigneeMurata Manufacturing Co., Ltd.
InventorKentaro Fujinaga
Life of this patent
Estimating the term…
Abstract
A module 1a includes an electronic component 3a, and also includes a wiring substrate 2 on one principal surface of which the electronic component 3a is mounted and in which a radiator 4 for dissipating heat generated from the electronic component 3 is provided. The radiator 4 includes a heat dissipation section 4a that is provided so that a part thereof is exposed to a side surface of the wiring substrate 2. In this case, because the heat dissipation section 4a is provided so that a part thereof is exposed to the side surface of the wiring substrate 2, the heat from the electronic component 3a can be dissipated through the side surface of the wiring substrate 2.
Claims9
A module comprising:
- a wiring substrate comprising a plurality of laminated insulation layers;
- an electronic component mounted on one principal surface of the wiring substrate;
- and
- a radiator provided in or on the wiring substrate and electrically insulated from the electronic component while a part of the radiator being in contact with the electronic component,
- wherein the radiator includes a heat dissipation section comprising a passing-through conductor passing through at least one of the insulation layers, and
- a part of the heat dissipation section is exposed to a side surface of the wiring substrate.
Dependencies are inferred from the claim text.