Interconnect Monitor Utilizing Both Open And Short Detection

A system for process monitoring of semiconductor fabrication, the system comprising:

• a semiconductor chip;
• a plurality of arrays disposed on the semiconductor chip;
• the arrays comprising a plurality of diodes, each diode formed in the chip, each diode associated with a stack comprising a plurality of vertical interconnects and metal contacts, the stack and the diode connected in series forming a diode stack combination;
• a plurality of control mechanisms for addressing the plurality of diodes;
• wherein the plurality of control mechanisms comprise:
• first inverters for applying either a high or a low voltage to a plurality of columns of the diode stack combinations in one of the plurality of arrays, connected at a first end of each diode stack combination, wherein each first inverter comprises reverse logic receiving a reverse logic signal and configured to invert a logic signal fed to the device for applying a relatively high or low voltage;
• and
• second inverters for applying either a high or a low voltage to a plurality of rows of the diode stack combinations in the one of the plurality of arrays, connected at a second end of said diode stack combination, wherein each second inverter comprises reverse logic receiving an inverted reverse logic signal and configured to invert a logic signal fed to the device for applying a relatively high or low voltage.