Automated optical inspection of unit specific patterning

An automated optical inspection (AOI) system, comprising:

• a camera for acquiring an image for each of a plurality of unit specific patterns;
• a unique reference standard generator for creating a plurality of unique reference standards for each of the plurality of unit specific patterns;
• a computer for detecting defects in the plurality of unit specific patterns by comparing one of the plurality of unique reference standards to the image of the plurality of unit specific patterns;
• and
• an output generator for creating an output of known good die in response to the computer detecting defects.

A method of using an automated optical inspection (AOI) system, comprising:

• capturing an image of a wafer comprising a plurality of unit specific patterns formed on the wafer;
• generating a netlist for the plurality of unit specific patterns on the wafer;
• and
• comparing the captured image to the netlist to ensure a continuous conductive path between points that should be electrically connected and no conductive path between points that should not be connected.