Method of manufacturing semiconductor package and semiconductor package

A method for manufacturing a semiconductor package comprising:

• forming a bottom groove portion on a second surface on the opposite side of a first surface in areas between a plurality of semiconductor devices arranged at intervals on the first surface side of a support substrate,
• arranging a plurality of semiconductor devices at intervals on the first surface side of the support substrate,
• forming an insulating resin layer forming a wiring connecting to each of the plurality of semiconductor devices and embeds the plurality of semiconductor devices, and
• separating by cutting from the first surface side along a boundary by a mechanical process.

A semiconductor package, comprising:

• a support substrate, and
• at least one semiconductor device arranged on a first surface of the support substrate;
• and
• an insulating resin layer arranged to cover the semiconductor devices and connected to at least one semiconductor device on the first surface side;
• wherein an end portion of the second surface opposite the first surface is located further inward than an end of the first surface on the support substrate.