Methods of forming conductive structures with different material compositions in a metallization layer

A method, comprising:

• forming a first trench and a second trench in at least one layer of insulating material, said first trench having a first lateral critical dimension, said second trench having a second lateral critical dimension that is greater than said first lateral critical dimension of said first trench;
• depositing a first bulk metal layer in both said first and second trenches;
• performing at least one first process operation to remove portions of said first bulk metal layer while leaving a remaining portion of said first bulk metal layer positioned within said first trench;
• depositing a second bulk metal layer above said remaining portion of said first bulk metal layer and within said second trench so as to overfill said second trench with said second bulk metal layer, wherein said first bulk metal layer and said second bulk metal layer comprise different materials;
• and
• performing at least one second process operation to remove materials positioned above an upper surface of said at least one layer of insulating material so as to define a narrow conductive structure positioned in said first trench and a wide conductive structure in said second trench.

A method, comprising:

• forming a first trench and a second trench in at least one layer of insulating material, said first trench having a first lateral critical dimension, said second trench having a second lateral critical dimension that is greater than said first lateral critical dimension of said first trench;
• depositing a first barrier layer in both said first and second trenches;
• depositing a first bulk metal layer on said first barrier layer in both said first and second trenches, wherein said first bulk metal layer overfills said first trench but only lines said second trench;
• performing at least one first process operation to remove portions of said first bulk metal layer while leaving a remaining portion of said first bulk metal layer positioned within said first trench;
• depositing a second barrier layer above said at least one layer of insulating material and on and in contact with said first barrier layer within said second trench;
• depositing a second bulk metal layer above said remaining portion of said first bulk metal layer and within said second trench above said second barrier layer so as to overfill said second trench with said second bulk metal layer, wherein said first bulk metal layer and said second bulk metal layer comprise different materials;
• and
• performing at least one second process operation to remove materials positioned above an upper surface of said at least one layer of insulating material so as to define a narrow conductive structure positioned in said first trench and a wide conductive structure in said second trench, said narrow conductive structure comprising said first bulk metal layer and said first barrier layer and said wide conductive structure comprising said first barrier layer, said second barrier layer and said second bulk metal layer.

A method, comprising:

• forming a first trench and a second trench in at least one layer of insulating material, said first trench having a first lateral critical dimension, said second trench having a second lateral critical dimension that is greater than said first lateral critical dimension of said first trench;
• depositing a first barrier layer in both said first and second trenches;
• depositing a first bulk metal layer on said first barrier layer in both said first and second trenches, wherein said first bulk metal layer overfills said first trench but only lines said second trench;
• performing at least one first process operation to remove portions of said first barrier layer and said first bulk metal layer from within said second trench while leaving a remaining portion of said first barrier layer and said first bulk metal layer positioned within said first trench;
• depositing a second barrier layer above said at least one layer of insulating material on and in contact with said first barrier layer within said second trench and within said second trench, wherein said second barrier layer is deposited on and in contact with said layer of insulating material within said second trench depositing a second bulk metal layer above said remaining portion of said first bulk metal layer and within said second trench above said second barrier layer so as to overfill said second trench with said second bulk metal layer, wherein said first bulk metal layer and said second bulk metal layer comprise different materials;
• and
• performing at least one second process operation to remove materials positioned above an upper surface of said at least one layer of insulating material so as to define a narrow conductive structure positioned in said first trench and a wide conductive structure in said second trench, said narrow conductive structure comprising said first bulk metal layer and said first barrier layer and said wide conductive structure comprising said second barrier layer and said second bulk metal layer.