Overmolded chip scale package

A semiconductor device packaged using an operation on a backside of a wafer, the operation comprising:

• placing a wafer on a carrier such that a backside of the wafer is facing up and a front side is facing down and non-permanently affixed to the surface of the carrier;
• performing lithography to mark one more areas to be etched on the backside of the wafer;
• etching the one or more marked areas from the backside of the wafer to form trenches that mark boundaries of individual devices including the semiconductor device on the wafer;
• applying a protective coating on the backside of the wafer, wherein the coating fills the trenches and entire backside of the wafer with a protective compound;
• and
• cutting the semiconductor device from the wafer.