Substrate support assembly for high temperature processes
AssigneeApplied Materials, Inc.
InventorVijay D. Parkhe
Life of this patent
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Abstract
An electrostatic chuck comprises a ceramic body having a top and a bottom, one or more heating elements disposed in the ceramic body, and one or more electrodes disposed in the ceramic body. The electrostatic chuck further comprises a plurality of objects bonded to the bottom of the ceramic body by a metal bond, wherein collectively the plurality of objects comprise a plurality of features distributed over the bottom of the ceramic body at a plurality of different distances from a center of a circle defined by the bottom of the ceramic body, and wherein a feature of the plurality of features accommodates a fastener.
Claims20
An electrostatic chuck comprising:
- a ceramic body having a top and a bottom;
- one or more heating elements disposed in the ceramic body;
- one or more electrodes disposed in the ceramic body;
- and
- a plurality of objects bonded to the bottom of the ceramic body by a metal bond, wherein collectively the plurality of objects comprise a plurality of features distributed over the bottom of the ceramic body at a plurality of different distances from a center of a circle defined by the bottom of the ceramic body, and wherein a feature of the plurality of features accommodates a fastener.
A substrate support assembly comprising:
- an electrostatic chuck comprising one or more objects bonded to a bottom of the electrostatic chuck by a metal bond, wherein collectively the one or more objects comprise a plurality of features distributed over the bottom of the electrostatic chuck at a plurality of different distances from a center of a circle defined by the bottom of the electrostatic chuck, and wherein collectively the plurality of features accommodate a plurality of fasteners;
- a base plate coupled to the electrostatic chuck by the plurality of fasteners, wherein the plurality of fasteners each apply an approximately equal fastening force to couple the base plate to the electrostatic chuck;
- and
- an o-ring disposed between the electrostatic chuck and the base plate at a periphery of the electrostatic chuck.
A base plate for a substrate support assembly, comprising:
- a metal body comprising a recess, the metal body comprising one or more features that accommodate a fastener;
- a metal cooling plate disposed in the recess, the metal cooling plate comprising a plurality of channels to receive a coolant, the metal cooling plate further comprising one or more surface features on a top of the metal cooling plate;
- a plurality of springs that connect a bottom of the metal cooling plate to the metal body;
- and
- a thermal gasket on the top of the cooling plate, the thermal gasket comprising one or more layers of polyimide and a plurality of layers of grafoil.
Dependencies are inferred from the claim text.