Method of Manufacturing Buffer Layers Having Composite Structures
OwnerKaixuan Chen, Wei Jiang +5inventors
InventorsKaixuan Chen, Wei Jiang, Zhiwei Lin, Xiangjing Zhuo, Tianzu Fang, Yang Wang, Jichu Tong
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OwnerKaixuan Chen, Wei Jiang +5inventors
InventorsKaixuan Chen, Wei Jiang, Zhiwei Lin, Xiangjing Zhuo, Tianzu Fang, Yang Wang, Jichu Tong
Estimating the term…
Disclosed is a method of manufacturing a semiconductor-based wafer for reducing misfit dislocation. The method includes steps of depositing a basis buffer layer of aluminum nitride (AlN) on a substrate; forming an AlN sublayer of a composite buffer layer on the basis buffer layer by supplying pulses of reactants for AlN for a first total pulse time period; forming an gallium nitride (GaN) sublayer of the composite buffer layer on the AlN sublayer by supplying pulses of reactants for GaN for a second total pulse time period; and growing additional composite buffer layers along a growth direction from the substrate to the composite buffer layers, by repeating steps of forming the AlN sublayer and forming the GaN sublayer. The first total pulse time period for each AlN sublayer decreases among the composite buffer layers along the growth direction.
A method of manufacturing a semiconductor-based wafer for reducing misfit dislocation, comprising:
A method of manufacturing an optoelectronic or electronic device that reduces misfit dislocation, the method comprising:
A method of manufacturing a semiconductor wafer that reduces misfit dislocation, the method comprising:
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