Formation of heteroepitaxial layers with rapid thermal processing to remove lattice dislocations
AssigneeUltratech, Inc.
InventorsAndrew M. Hawryluk, Ganesh Sundaram, Ritwik Bhatia
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AssigneeUltratech, Inc.
InventorsAndrew M. Hawryluk, Ganesh Sundaram, Ritwik Bhatia
Estimating the term…
Method and devices are disclosed for device manufacture of gallium nitride devices by growing a gallium nitride layer on a silicon substrate using Atomic Layer Deposition (ALD) followed by rapid thermal annealing. Gallium nitride is grown directly on silicon or on a barrier layer of aluminum nitride grown on the silicon substrate. One or both layers are thermally processed by rapid thermal annealing. Preferably the ALD process use a reaction temperature below 550° C. and preferable below 350° C. The rapid thermal annealing step raises the temperature of the coating surface to a temperature ranging from 550 to 1500° C. for less than 12 msec.
A material processing apparatus for applying a material coating layer onto a coating surface of a substrate comprising:
Dependencies are inferred from the claim text.