3-d stacked memory with reconfigurable compute logic
AssigneeSamsung Electronics Co., Ltd.
InventorsMu-Tien Chang, Prasun Gera, Dimin Niu, Hongzhong Zheng
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Abstract
A 3D-stacked memory device including: a base die including a plurality of switches to direct data flow and a plurality of arithmetic logic units (ALUs) to compute data; a plurality of memory dies stacked on the base die; and an interface to transfer signals to control the base die.
Claims20
A 3D-stacked memory device comprising:
- a base die comprising a plurality of switches configured to direct data flow and a plurality of arithmetic logic units (ALUs) configured to compute data;
- a plurality of memory dies stacked on the base die;
- and
- an interface configured to transfer signals to control the base die.
A method of operating a 3D-stacked memory device comprising a base die comprising a plurality of switches and a plurality of arithmetic logic units (ALUs), a plurality of memory dies stacked on the base die, and an interface configured to control the base die, the method comprising:
- configuring the switches to direct data flow according to configuration instructions;
- controlling operations of the ALUs to compute data according to logic commands;
- and
- storing the computed data in the memory dies.
An interface of a memory device comprising a processor in memory, the interface comprising:
- a control bus configured to transfer commands from an external host to the memory device;
- and
- a data bus configured to transfer data between the memory device and the host;
- wherein the interface is configured to transfer the commands to set the memory device to operate in a PIM mode to compute data, and to set the memory device to operate in a normal mode to perform memory functions, and
- wherein the memory device is configured to translate memory commands into logic commands to compute the data according to the logic commands when in the PIM mode, and to perform the memory functions according to the memory commands when in the normal mode.
Dependencies are inferred from the claim text.