Methods and Systems for Creating or Performing a Dynamic Sampling Scheme for a Process During Which Measurements Are Performed on Wafers

A system operable to pattern wafer, comprising:

• a measurement tool operable to perform measurements on the wafer;
• one or more processors operable to:
• model deformation of the wafer based on results of the measurements;
• and
• alter one or more parameters of a patterning process based on the deformation of the wafer;
• and
• a patterning tool operable to pattern the wafer using the patterning process after the one or more parameters of the patterning process have been altered to produce a first patterned wafer.

A system operable to process a wafer, comprising:

• a measurement tool operable to perform measurements on the wafer;
• one or more processors operable to:
• model deformation of the wafer based on results of the measurements;
• and
• alter one or more parameters of a fabrication process based on the deformation of the wafer;
• and
• a processing tool operable to perform the fabrication process on the wafer using the fabrication process after the one or more parameters of the fabrication process have been altered.