Photosensitive resin composition for forming interlayer insulating film, interlayer insulating film, and method for forming interlayer insulating film
AssigneeTokyo Ohka Kogyo Co., Ltd.
InventorKazuhide UNO
Life of this patent
Estimating the term…
Abstract
A photosensitive resin composition for forming an interlayer insulating film, which contains an alkali-soluble resin (A), a photosensitizer (B), a thermal acid generator (T) which generates an acid when heated, and a silane coupling agent (C), and wherein the alkali-soluble resin (A) has a constituent unit (A1) represented by general formula (a-1) or an alicyclic epoxy group-containing unit (A3). In general formula (a-1), R represents a hydrogen atom or a methyl group; and Ra01 represents a hydrogen atom or an organic group having a hydroxyl group.
Claims9
A photosensitive resin composition for forming an interlayer insulating film, comprising:
- an alkali-soluble resin (A) including a structural unit (A1) represented by the following general formula (a-1) or an alicyclic epoxy group-containing unit (A3);
- a photosensitizer (B);
- a thermal acid generator (T) which generates an acid when heated;
- and
- a silane coupling agent (C):
- wherein R represents a hydrogen atom, or a methyl group;
- and Ra01 represents a hydrogen atom or an organic group having a hydroxyl group.
Dependencies are inferred from the claim text.