Pressure sensor and manufacturing method thereof

A manufacturing method for pressure sensor, comprising the following steps:

• Step 1:
• making a lead frame:
• the lead frame is made of tin bronze material, and both the pin and bonding pad in the lead frame are nickeled for 2 microns and gilded for 0.05 microns;
• Step 2:
• the housing of sensor, the air lead-in hole, the pressure lead-in holes and the inner cavity are formed by means of an injection molding process;
• the housing and the cover plate are made of PBT+30% GF;
• while the housing is injected, the lead frame is tightly adhered with the housing through this process, a bonding pad of the lead frame is disposed on each of steps in the inner cavity, and then a pin of the lead frame is bent;
• Step 3:
• the sensor chip is adhered in the center of surface-mounted device surface in the housing in an inverted manner to make the cavity of the sensor chip be in communication with the pressure lead-in hole, wherein the sensor chip is tightly adhered with the surface-mounted device surface by means of adhesives, and then they are dried at the temperature of 150° C. for 10˜60 min, 30 min optimally, so as to make the sensor chip compactly and firmly be communication with the surface-mounted device surface;
• Step 4:
• the sensor chip and the lead frame are electrically connected in a gold wire bonding manner;
• Step 5:
• the cover plate is adhered with the bottom of the housing cavity by means of adhesives, and they are dried at the temperature of 150° C. for 10-60 min, 30 min optimally.