High density sensor module

A high-density sensor module comprising:

• a first substrate comprising a supporting substrate, the supporting substrate comprises a first surface;
• a plurality of first sensors positioned on the first substrate;
• a plurality of first conductive rods positioned on the plurality of first sensors, each of the plurality of first conductive rods are respectively corresponding to each of the plurality of the first sensors;
• a first package resin member covering the plurality of first sensors and one end of each of the plurality of first conductive rods;
• a second substrate positioned on the first package resin member, wherein the plurality of first conductive rods pass through the first package resin member and the second substrate;
• a plurality of second sensors positioned on the second substrate, the plurality of second sensor and first sensor being periodically alternately arranged, wherein the projections of the second sensing surfaces of the second sensors overlaps with the projections of the first sensing surfaces of the first sensors;
• a plurality of second conductive rods positioned on the plurality of second sensors, each of the plurality of second conductive rods are respectively corresponding to each of the plurality of second sensors;
• and
• a second package resin member covering the plurality of second sensors and another end of each of the plurality of first conductive rods.