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US 2017/0254600 A1Published application
Heat pipe module and heat dissipating device using the same
AssigneeCooler Master Co., Ltd.
InventorsChien-Hung SUN, Te-Hsuan CHIN
Life of this patent
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Abstract
A heat pipe module includes at least one first pipe body and at least one second pipe body. The inner wall of the first pipe body defines a hollow chamber. A part of the second pipe body is disposed in the hollow chamber, and the external wall of the part of the second pipe body directly contacts the first pipe body.
Claims20
A heat pipe module, comprising:
- at least a first pipe body, wherein an inner wall of the first pipe body defines a hollow chamber;
- and
- at least a second pipe body, wherein a part of the second pipe body is disposed in the hollow chamber, and an external wall of the part of the second pipe body directly contacts the first pipe body.
A heat dissipating device, comprising:
- a heat pipe module comprising at least a first pipe body and at least a second pipe body, wherein an inner wall of the first pipe body defines a hollow chamber, a part of the second pipe body is disposed in the hollow chamber, and an external wall of the part of the second pipe body directly contacts the first pipe body;
- and
- a heat sink having a plurality fins disposed on the second pipe body.
Dependencies are inferred from the claim text.