Substrate processing apparatus, substrate processing method, and storage medium
AssigneeTokyo Electron Limited
InventorsGentaro Goshi, Hiromi Kiyose, Satoshi Biwa
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AssigneeTokyo Electron Limited
InventorsGentaro Goshi, Hiromi Kiyose, Satoshi Biwa
Estimating the term…
Provided is a substrate processing apparatus including a processing container configured to receive a substrate on which a dry preventing liquid is filled and perform a supercritical processing on the substrate; a fluid supply line connected to the processing container and configured to supply a processing fluid to the processing container; a fluid discharge line connected to the processing container and configured to discharge the processing fluid in the processing container; and a first circulation line connected to an upstream side and a downstream side of the processing container, and provided independently from the fluid supply line and the fluid discharge line to circulate the processing fluid in the processing container. The first circulation line is provided with a first reservoir tank that receives the processing fluid from the processing container and has a capacity larger than that of the processing container.
A substrate processing apparatus comprising:
A substrate processing method, comprising:
A non-transitory computer-readable storage medium that stores a program which, when executed, causes a computer to execute a substrate processing method, the substrate processing method including:
Dependencies are inferred from the claim text.