Method for manufacturing wiring substrate and wiring substrate manufactured thereby
AssigneeC. Uyemura & Co., Ltd.
InventorsHisamitsu YAMAMOTO, Tomohiro KAWASE, Masaharu TAKEUCHI
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AssigneeC. Uyemura & Co., Ltd.
InventorsHisamitsu YAMAMOTO, Tomohiro KAWASE, Masaharu TAKEUCHI
Estimating the term…
Disclosed herein is a method for fabricating a wiring board in which a target substrate having via holes and/or trenches is subjected to an electroless plating process while being immersed in an electroless plating solution to fill the via holes and/or the trenches with a plating metal. The method includes the steps of: supplying the electroless plating solution to under the target substrate; diffusing an oxygen-containing gas into the electroless plating solution supplied under the target substrate; and allowing the electroless plating solution to overflow from over the target substrate.
A method for fabricating a wiring board in which a target substrate having via holes and/or trenches is subjected to an electroless plating process while being immersed in an electroless plating solution to fill the via holes and/or the trenches with a plating metal, the method comprising the steps of:
Dependencies are inferred from the claim text.