Substrate processing apparatus
AssigneeHitachi Kokusai Electric Inc.
InventorTakashi YAHATA
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AssigneeHitachi Kokusai Electric Inc.
InventorTakashi YAHATA
Estimating the term…
Described herein is a technique that can improve a quality of substrate processing. A substrate processing apparatus may include: a plurality of processing chambers; a vacuum transfer chamber; a plurality of transfer chambers; a plurality of gate valves; a plurality of first gas supply units configured to supply an inert gas to a substrate; a transfer robot; and a control unit configured to control the plurality of first gas supply units and the transfer robot to: supply the inert gas to the substrate at a first flow rate when a distance between a gas supply port and the substrate passing through the plurality of gate valves is a first distance; and supply the inert gas to the substrate at a second flow rate greater than the first flow rate when the distance between the gas supply port and the substrate is a second distance greater than the first distance when the substrate passes through the plurality of gate valves.
A substrate processing apparatus comprising:
Dependencies are inferred from the claim text.