Silicon wafer polishing composition

A method for polishing a silicon wafer, the method comprising the steps of:

• obtaining a polishing composition comprising a silicon wafer polishing accelerator, an amide group-containing polymer, and water;
• and
• supplying the polishing composition to the silicon wafer to carried out a final polishing of the silicon wafer in the presence of an abrasive,
• wherein
• the amide group-containing polymer has a building unit A in its main chain,
• the building unit A comprises a main chain carbon atom constituting the main chain of the amide group-containing polymer and a secondary amide group or a tertiary amide group, and
• the secondary amide group or tertiary amide group has a carbonyl carbon directly coupled to the main chain carbon atom.