Thermosetting resin composition
AssigneeTeijin Limited
InventorsShinichiro SHOJI, Kouhei ENDO, Masaya SHIBANO
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AssigneeTeijin Limited
InventorsShinichiro SHOJI, Kouhei ENDO, Masaya SHIBANO
Estimating the term…
A thermosetting resin composition which produces no free isocyanate even when a carbodiimide compound is used and provides a cured resin having high heat resistance. The thermosetting resin composition makes it possible to reduce the curing temperature, cures in a short time and provides a cured rein having a high glass transition temperature. The thermosetting resin composition comprises: (A) an epoxy resin (component A); and (B) a cyclic carbodiimide compound (component B) including a cyclic structure having one carbodiimide group and represented by the following formula (B-i) in which first nitrogen and second nitrogen are bonded together by a bond group and having 8 to 50 atoms forming the cyclic structure: (wherein Q is bivalent to tetravalent bond group which is an aliphatic group, alicyclic group, aromatic group, or a combination of these groups and may contain a hetero atom or substituent); and/or (b) a polyvalent amine-based curing agent (component b) represented by the following formula (b-i): (wherein Ar1 to Ar4 are each independently a phenylene group or naphthalene-diyl group which may be substituted by a substituent).
A thermosetting resin composition comprising:
A method of using a cyclic carbodiimide compound (component B) including a cyclic structure having one carbodiimide group and represented by the following formula (B-i) in which first nitrogen and second nitrogen are bonded together by a bond group and having 8 to 50 atoms forming the cyclic structure as a curing agent for an epoxy resin (component A):
A method of using a cyclic carbodiimide compound (component B) including a cyclic structure having one carbodiimide group and represented by the following formula (B-i) in which first nitrogen and second nitrogen are bonded together by a bond group and having 8 to 50 atoms forming the cyclic structure as a curing accelerator for an epoxy resin (component A):
A cured resin comprising a compound represented by the following formula (b-ii):
Dependencies are inferred from the claim text.