Lead-free low-melting glass composition, low-temperature sealing glass frit, low-temperature sealing glass paste, conductive material, and conductive glass paste containing glass composition, and glass-sealed component and electric/electronic component prepared using the same

A lead-free low-melting glass composition comprising:

• a principal component which includes a vanadium oxide, a tellurium oxide and a silver oxide;
• and
• an additional component which includes at least one selected from the group consisting of oxides of elements in Group 13 of periodic table,
• wherein a content of TeO2 is 1 to 2 times as much as a content of V2O5, and
• wherein a content of the additional component is 0.1 to 3.0 mole percent.

A glass-sealed component having a seal portion including 40 to 100 volume percent of a lead-free low-melting glass phase,

• wherein the lead-free low-melting glass phase includes a principal component including a vanadium oxide, a tellurium oxide and a silver oxide,
• a content of TeO2 is 1 to 2 times as much as a content of V2O5, and
• wherein the lead-free low-melting glass phase further includes an additional component including at least one selected from the group consisting of B2O3, Al2O3, Ga2O3 and In2O3, and
• a content of the additional component in the lead-free low-melting glass phase is 0.1 to 2.0 mole percent.

An electrical/electronic component comprising at least one unit selected from the group consisting of electrodes, interconnections, and conductive junctions,

• wherein the unit includes 5 or greater volume percent and less than 100 volume percent of a lead-free low-melting glass phase, and greater than 0 volume percent and 95 or less volume percent of metal particles,
• the lead-free low-melting glass phase including a principal component, a secondary component and an additional component,
• wherein the principal component includes a vanadium oxide, a tellurium oxide and a silver oxide,
• a content of TeO2 being 1 to 2 times as much as a content of V2O5, and
• wherein the additional component includes at least one selected from the group consisting of B2O3, Al2O3, Ga2O3, and In2O3,
• a content of the additional component in the lead-free low-melting glass phase being 0.1 to 2.0 mole percent,
• the metal particles including at least one selected from the group consisting of silver, silver alloys, copper, copper alloys, aluminum, aluminum alloys, tin and tin alloys.