Integrated Circuit Package with Sensor and Method of Making
AssigneeTexas Instruments Incorporated
InventorsMakoto Shibuya, Luu Nguyen, Noboru Nakanishi
Life of this patent
Estimating the term…
Abstract
An integrated circuit (“IC”) package comprising an IC die having a top surface and a bottom surface, an elongate member having opposite first and second end portions and a mid portion. The mid portion is positioned proximate the top surface of the IC die. The IC package also includes an encapsulant block having a top surface, a bottom surface and opposite first and second lateral side surfaces. The encapsulant block encapsulates the IC die and the elongate member. Either or both of the first and second end portions of the elongate member are exposed.
Claims20
An integrated circuit (“IC”) package comprising:
- an IC die having a top surface and a bottom surface;
- an elongate member having opposite first and second end portions and a mid portion, said mid portion engaging said top surface of said IC die;
- and
- an encapsulant block having a top surface, a bottom surface and opposite first and second lateral side faces, said encapsulant block encapsulating said IC die and said elongate member with at least one of said first and second end portions of said elongate member exposed;
- said IC die comprising a sensor die having a sensing element on said top surface thereof, said elongate member being constructed and arranged to transmit gas therethrough to said sensing element;
- said first and second end portions of said elongate member being exposed at opposite lateral side surfaces of said encapsulant block;
- said elongate member being one of:
- a tubular member, with at least one hole in said mid portion thereof that is constructed from at least one of:
- carbon-nylon composite, epoxy resin and fluorine-containing rubber;
- and
- a porous member adapted to transmit gas therethrough and constructed from at least one of polytetrafluoroethylene (“PTFE”) and porous ceramic;
- and
- a leadframe having a die pad and a plurality of leads, said IC die bottom surface being attached to said die pad, said die pad and said leads being exposed at said bottom surface of said encapsulant block wherein said IC die comprises a plurality of electrical contact pads on at least one exterior surface thereof that are wire bonded to at least one of said plurality of leadframe leads.
A method of making an integrated circuit (“IC”) package comprising:
- attaching to an IC die mounted on a leadframe an elongate member that is adapted to transmit gas to a top surface of the IC die;
- and
- encapsulating the IC die, elongate member and leadframe in mold compound in a manner that leaves surface portions of a die pad and leads of the leadframe and end portions of the elongate member exposed.
A method of determining the value of a parameter of gas in a local environment with an encapsulated integrated circuit sensor assembly comprising:
- passing gas from the local environment to a sensing element inside the encapsulated sensor assembly through an elongate member in fluid communication with the local environment
An integrated circuit (“IC”) package comprising:
- an IC die having a top surface and a bottom surface;
- an elongate member having opposite first and second end portions and a mid portion, said mid portion positioned proximate said top surface of said IC die;
- an encapsulant block having a top surface, a bottom surface and opposite first and second lateral side faces, said encapsulant block encapsulating said IC die and said elongate member with at least one of said first and second end portions of said elongate member exposed;
- and
- a leadframe having a die pad and a plurality of leads, said IC die bottom surface being attached to said die pad, said die pad and said leads being exposed at said bottom surface of said encapsulant block, wherein said IC die comprises a plurality of electrical contact pads on at least one exterior surface thereof that are wire bonded to at least one of said plurality of leadframe leads.
Dependencies are inferred from the claim text.