Package structure of and packaging method for array substrate and display panel

A method for packaging an array substrate, comprising:

• providing the array substrate, wherein a plurality of organic light emitting display units are formed in a display region on a surface of the array substrate;
• forming a first inorganic film layer covering the plurality of organic light emitting display units, in the display region on the surface of the array substrate;
• forming a bump structure, on a periphery of the display region of the array substrate;
• processing a surface of the bump structure, so as to enable the surface of the bump structure to have repellence against formation solution of the organic film layer to be formed;
• and
• forming an organic film layer, on a surface of the first inorganic film layer away from the array substrate in the display region encircled by the bump structure, with a thickness of the organic film layer being greater than a height of the bump structure;
• and, wherein
• a forming process for the organic film layer is an inkjet printing process.

A display panel, comprising a package structure, wherein the package structure comprises:

• an array substrate, wherein a plurality of organic light emitting display units are formed in a display region of the array substrate;
• a first inorganic film layer covering the plurality of organic light emitting display units, located in the display region of the array substrate;
• a bump structure, located on a periphery of the display region of the array substrate;
• and
• an organic film layer, located on a surface of the first inorganic film layer away from the array substrate in the display region encircled by the bump structure;
• and, wherein
• a surface of the bump structure has repellence against formation solution of the organic film layer, and a thickness of the organic film layer is greater than a height of the bump structure.