Heat dissipation from circuits through quantom dot optics and led integration
OwnerThomas Paulosinventor
Life of this patent
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Abstract
A method is presented for forming a structure for dissipating heat. The method includes forming a first conductive material, forming a dielectric layer over the first conductive material, and forming a second conductive material over the dielectric layer such that the first and second conductive materials are coplanar along a longitudinal axis defined by a mounting surface of the first and second conductive materials. The method further includes attaching an electronic component to the mounting surface of the first and second conductive materials such that a first electrode of the electronic component electrically contacts the first conductive material and a second electrode of the electronic component electrically contacts the second conductive material.
Claims26
A method of forming a structure for dissipating heat, the method comprising:
- forming a first conductive material;
- forming a dielectric layer over the first conductive material;
- forming a second conductive material over the dielectric layer such that the first and second conductive materials are coplanar along a longitudinal axis defined by a mounting surface of the first and second conductive materials;
- and
- attaching an electronic component to the mounting surface of the first and second conductive materials such that a first electrode of the electronic component electrically contacts the first conductive material and a second electrode of the electronic component electrically contacts the second conductive material.
A method of forming a structure for dissipating heat, the method comprising:
- forming a dielectric layer;
- forming a plurality of first conductive materials defining a first type of configuration on a first side of the dielectric layer;
- forming a plurality of second conductive materials defining a second type of configuration on a second side of the dielectric layer, where the second type of configuration is different than the first type of configuration;
- and
- attaching an electronic component to each of the plurality of first and second conductive materials such that a first electrode of the electronic component electrically contacts a first conductive material and a second electrode of the electronic component electrically contacts a second conductive material on opposed ends of the dielectric layer.
A structure for dissipating heat, the structure comprising:
- a first conductive material;
- a dielectric layer formed over the first conductive material;
- a second conductive material formed over the dielectric layer such that the first and second conductive materials are coplanar along a longitudinal axis defined by a mounting surface of the first and second conductive materials;
- and
- an electronic component attached to the mounting surface of the first and second conductive materials such that a first electrode of the electronic component electrically contacts the first conductive material and a second electrode of the electronic component electrically contacts the second conductive material.
Dependencies are inferred from the claim text.