Light emitting module and light emitting module manufacturing method
AssigneeToshiba Hokuto Electronics Corporation
InventorKeiichi MAKI
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Abstract
A light emitting module includes a first light transmissive insulator, a conductive circuitry layer formed on a surface of the first light transmissive insulator, a second light transmissive insulator disposed so as to face the conductive circuitry layer, a light emitting element disposed between the first light transmissive insulator and the second light transmissive insulator, and connected to the conductive circuitry layer, and a third light transmissive insulator which is disposed between the first light transmissive insulator and the second light transmissive insulator, and which is thermosetting.
Claims19
A light emitting module comprising:
- a first light transmissive insulator;
- a conductive circuitry layer formed on a surface of the first light transmissive insulator;
- a second light transmissive insulator disposed so as to face the conductive circuitry layer;
- a light emitting element disposed between the first light transmissive insulator and the second light transmissive insulator, and connected to the conductive circuitry layer;
- and
- a third light transmissive insulator which is disposed between the first light transmissive insulator and the second light transmissive insulator, and which is thermosetting.
A manufacturing method of a light emitting module comprising a light emitting element disposed between the first light transmissive insulator and a second light transmissive insulator, the manufacturing method comprising:
- forming a conductive circuitry layer on a surface of the first light transmissive insulator;
- disposing a light transmissive insulation resin sheet that is thermosetting;
- disposing a light emitting element;
- and
- pressurizing and heating the first light transmissive insulator, the light transmissive insulation resin sheet, and the light emitting element.
Dependencies are inferred from the claim text.