A resistive random-access memory in printed circuit board

A method of manufacturing, including:

• forming a first electrode from a portion of a first layer of printed circuit board;
• forming a switching layer over a portion of the first electrode, the switching layer including a metal oxide;
• and
• forming over a portion of the switching layer a second electrode, wherein the second electrode is a part of a second layer of the printed circuit board;
• wherein the first electrode, the switching layer, and the second electrode are parts of a resistive random-access memory embedded in the printed circuit board.

A method of manufacturing, including:

• disposing a resist over a clad& g layer including a first metal-containing material, the cladding layer disposed over a substrate that is one layer of a printed circuit board;
• etching, using a first mask, at least a portion of the resist and a portion of the cladding layer to form a first electrode, which is disposed over the substrate;
• disposing an oxide layer including a metal oxide over at least a portion of the first electrode and a portion of the substrate;
• disposing a second metal-containing material over the oxide layer;
• etching, using a second mask, at least a portion of the second metal-containing material and a portion of the oxide layer to form respectively a second electrode and a switching layer, the second electrode disposed over the switching layer including the metal oxide, the switching layer disposed over the first electrode,
• whereby a resistive random-access memory including the first electrode, the switching layer, and the second electrode is formed embedded in the printed circuit board.