Conductive traces in semiconductor devices and methods of forming same

A method comprising:

• forming a first contact pad on the top surface of a semiconductor device, wherein the first contact pad is electrically connected to the semiconductor device;
• forming a dielectric layer over the contact pad;
• forming a first polymer layer over the dielectric layer;
• forming a first conductive line and a first portion of a second conductive line over the first polymer layer, wherein the first conductive line extends through the polymer layer and the dielectric layer to physically contact the contact pad, and wherein the first conductive line and the first portion of the second conductive line physically contact the top surface of the first polymer layer;
• patterning a photoresist to form an opening over the first portion of the second conductive feature, wherein after patterning the photoresist the first conductive line remains covered by photoresist;
• forming a second portion of the second conductive line in the opening, wherein the second portion of the second conductive line physically contacts the first portion of the second conductive line;
• and
• forming a second polymer layer extending completely over the first conductive line and the second portion of the second conductive line, wherein the second polymer layer covers the sidewalls of the first conductive line and the sidewalls of the first portion of the second conductive line.

A method of forming a device comprising:

• depositing a passivation layer over a die having a contact pad;
• depositing a first polymer layer over the passivation layer;
• forming an opening in the first polymer layer to expose the contact pad;
• depositing a first photoresist layer over the first polymer layer;
• patterning a first plurality of openings in the first photoresist layer;
• depositing a first conductive material into the first plurality of openings to form a first plurality of conductive features, wherein a portion of the conductive material extends into the opening in the first polymer layer to contact the contact pad;
• depositing a second photoresist layer over the first polymer layer;
• patterning a second plurality of openings in the second photoresist layer to expose at least one of the first plurality of conductive features, wherein at least one of the first plurality of conductive features remains covered by the second photoresist layer;
• and
• depositing a second conductive material into the second plurality of openings.