US 2017/0250124 A1 · SEMICONDUCTOR DEVICE

Abstract

A semiconductor device that includes a first die pad, an adhesive, and a second die pad fixed to the top surface of the first die pad via the adhesive. The second die pad includes a body portion and a protrusion portion provided on a side surface of the body portion. A semiconductor chip is fixed to a top surface of the second die pad, and a lead is electrically connected to the semiconductor chip. The semiconductor device further includes a package material that covers the first die pad, the second die pad, the semiconductor chip, and the lead. The first die pad is substantially as thick as the lead.

Claims17

Dependent claims

A semiconductor device comprising:

a first die pad;
an adhesive;
a second die pad fixed to a top surface of the first die pad via the adhesive, the second die pad including a body portion and a protrusion portion provided on a side surface of the body portion;
a semiconductor chip fixed to a top surface of the second die pad;
a lead electrically connected to the semiconductor chip;
and
a package material that covers the first die pad, the second die pad, the semiconductor chip, and the lead, wherein
the first die pad is substantially as thick as the lead.

5 more elements

Dependencies are inferred from the claim text.

Facts

Application

15/252,915Filed 31 Aug 2016

Priority

JP 2016-03710229 Feb 2016

Published

31 Aug 2017

Term ends

Not estimatedThe source records don’t support an estimate.

Classification20 codes

H10W 70/411
Leadframes: chip-supporting parts, e.g. die pads
H10W 70/048
Of leadframes: mechanical treatments, e.g. punching, cutting, deforming or cold welding
H10W 70/421
Leadframes: shapes or dispositions
H10W 70/442
Shapes or dispositions: of multiple leadframes in a single chip

Semiconductor device

Life of this patent

Semiconductor device

Life of this patent

Abstract

Claims17