Combined method for producing solids, involving laser treatment and temperatureinduced stresses to generate three-dimensional solids

A method for the production of at least one three-dimensional layer of solid material for usage as wafer and/or at least one three-dimensional solid body, the method comprising:

• providing a work piece for removing of layers of solid material and/or the solid body, wherein the work piece includes a first level surface portion and a second level surface portion, wherein the first level surface portion aligns substantially or exactly parallel to the second level surface portion;
• wherein the work piece includes at least one exposed surface formed by the second level surface portion;
• generating defects inside the work piece with laser beams of a laser, wherein the laser beams penetrate into the solid body through the second level surface portion;
• wherein the defects define at least one crack directing layer;
• wherein the crack directing layer describes at least one three-dimensional contour;
• and
• attaching or generating a receiving layer at the exposed surface of the work piece by forming a composite structure;
• thermal treating of the receiving layer to generate stresses inside the work piece, wherein the stresses cause a crack propagation inside the work piece;
• and
• wherein a layer of solid material or a three-dimensional solid body is separated along the crack directing layer due to the crack propagation, wherein a surface of the layer of solid material or a surface of the solid body corresponds to the three-dimensional contour of the crack directing layer.