Film stress uniformity control by rf coupling and wafer mount with adapted rf coupling

Abstract

A fixture or clamp for a wafer in a vacuum treatment system has a non-conductive body with a first plane surface for arranging a substrate (wafer) thereon and a second surface opposite to first surface. A body includes a plurality of electrode-pairs; each electrode pair comprising a first electrode with a first electrode surface and a second electrode with a second electrode surface, electrode surfaces interconnected via a conductive member and arranged essentially in parallel to the first and second surfaces, the first electrode located closer to the first surface than the second electrode and the second electrode located closer to the second surface than the first electrode. Such a body can be used for RF coupling between the wafer and pedestal on RF potential to achieve a uniform film stress profile/distribution during film deposition or other substrate treatment.

Dependencies are inferred from the claim text.