Systems and apparatus for housing electronic components and methods thereof

A structure for housing electronic components, comprising:

• an innermost textile layer;
• an outermost textile layer;
• the innermost layer bonded to the outermost layer to form a combined layer;
• and
• the combined layer being transparent to electromagnetic waves having a frequency between 600 MHz and 6 GHz or not being electrically conductive across an entire surface area of the combined layer.

A structure for housing electronic components, comprising:

• a first layer having a modulus of less than 2.41 MPa;
• a second layer having a modulus of less than 2.41 MPa;
• and
• the second layer affixed to the first layer to form a combined layer, the combined layer being polycarbonate free.